Merck-Micron-join-hands
Researchers of Merck and Micron Technology work together to find out new technology with the aim of substantially reducing carbon emissions. Photo courtesy of Merck

Two tech giants will cooperate for sustainable gas solutions in chip industry

Germany’s Merck and Micron Technology of the United States announced on Aug. 4 that the two would cooperate in developing gas solutions to reduce carbon emissions in chip production.

Micron is now testing an alternative low-global warming potential (GWP) etch gas from Merck’s research unit to validate its process performance to replace a traditional, high-GWP material.

The two outfits noted that the two-way collaboration is geared toward finding new, more sustainable gas solutions to be introduced permanently into the production of semiconductors in the future.

“Sustainability needs collaboration. We must not think in silos or limit ourselves merely to our corporate boundaries. The entire value chain is called upon to explore new, joint paths in order to achieve even more together,” Merck executive board member Kai Beckmann said.

“Like Merck, Micron has set itself ambitious sustainability goals. We are pleased to be able to contribute to their success.”

Micron Corporate Vice President John Whitman said that it aimed to reduce emissions by 42 percent across its global operations from 2020 levels by 2030.

“We take a multifaceted approach toward meeting our net-zero operational commitments. This includes investing in advanced abatement systems, prioritizing the use of gases with lower global warming potential, sourcing energy-efficient equipment, and purchasing renewable instead of fossil fuel-generated energy,” he said.

“We are glad to have an innovative partner in Merck to help us achieve these goals.”

This is not the first time the two global tech giants have joined forces.

They are working to discover new materials to replace various etching gases with high global warming potential that are used in dry etch and chamber cleaning applications.